Solder Paste

Application:

We offer not only conventional lead-free solder paste but eco-friendly halogen-free, crack-free flux residue and many others.

TLF-204 & GP Series

Features:

◎Lead-free solder paste

For various product categories from white goods to automotive, IoT devices

Wide rage lead-free options: SAC 0307 from SAC 305

Applicable to small to large components (Particle size: Type 4 to Type 6)

Halogen-free available

※Halogen free （IEC61249-2-21）
　・Chlorine (Cl) content: 0.09 wt% (900 ppm) or less
　・Bromine (Br) content: 0.09 wt% (900 ppm) or less
　・Total chlorine (Cl) and bromine (Br) content: 0.15 wt% (1500 ppm) or less

TLF-204-93 Lead-free solder paste

Features:

  • Excellent total balance
  • Soldering resistance
  • Stable printability

Features:

  • Head-on-Pillow reduction
  • Heat resistance to high pre-heating -temperature
  • Void reduction
  • Solderability at small lands

TLF-204-MDS Series Solder Paste for BGA Head -on-Pillow Reduction

Specifications

ITEM

TLF-204-MDS

TLF-204-MDS2

TLF-204-MDS3

Alloy Composition

Sn/3.0Ag/0.5Cu

Sn/3.0Ag/0.5Cu

Sn/3.0Ag/0.5Cu

Melting Point (°C)

216～220

216～220

216～220

Particle Size of Solder Powder (μm)

25～41

20～36

25～41

Flux Content (%)

10.9

11

11

Chlorine Content (%)

0

0

0

Viscosity (Pa.s)

195

195

195

Thixotropy Index

0.55

0.57

0.55

TLF-204-171 Series Solder paste for fine-pitch/ high speed printing

Test condition
Stencil thickness:100μm
Opening:0.24mmφ

Features:

  • Stable printability
  • Compatible with various components
  • Void reduction
  • Good results at ICT

TLF-204-189 Solder paste for void and flux scattering reduction

Features:

  • Void reduction
  • Less flux  scattering
  • Low flux residues
  • Printability improved

TLF-204-NH Halogen-Free Solder Paste

Features:

  • Halogen compounds are not intentionally added
  • Stable printability with continuous printing
  • Good solder ability in air reflow
  • Suitable with conventional lead-free standard reflow profile

RMA-785-13H Low flux residue solder paste for N2 reflow

Features:

  • Low flux residues (good results at ICT)
  • Less flux  scattering
  • Applicable to vacuum reflow
  • Excellent electrical reliability

TLF-204-75 Cleanable No-Clean Solder Paste

Features:

  • Flux residue can easlily be removed  using hydrocarbon-base or semi-aqueous detergents
  • Good solderablity with fine pitch components: 0.4mmP QFP
  • Good solderbility/ wettability to various components

TLF-204W-13 Water cleanable Solder Paste

After（50℃/5minute）

Features:

  • Flux residue removable by water cleaning after high-temperature reflow
  • Good solderability compatible with 0.4mm-pitch CSP and other fine patterns
  • Good solderability compatible with both nitrogen and air reflow

TLF-401-11 Bi-type low melting point solder paste

Printability at 0.4mm pitch

Features:

  • For low-temperature air reflow
  • Stable printability with continuous printing
  • Good solder ability to various components

TLF-801-17 In-type low melting point solder paste

Features:

  • Good solder ability/wettability
  • Less solder balls
  • Excellent printability