Application:

We offer not only conventional lead-free solder paste but eco-friendly halogen-free, crack-free flux residue and many others.

Features:

◎Lead-free solder paste

For various product categories from white goods to automotive, IoT devices

Wide rage lead-free options: SAC 0307 from SAC 305

Applicable to small to large components (Particle size: Type 4 to Type 6)

Halogen-free available

※Halogen free （IEC61249-2-21）
　・Chlorine (Cl) content: 0.09 wt% (900 ppm) or less
　・Bromine (Br) content: 0.09 wt% (900 ppm) or less
　・Total chlorine (Cl) and bromine (Br) content: 0.15 wt% (1500 ppm) or less

Features:

• Excellent total balance
• Soldering resistance
• Stable printability

Features:

• Head-on-Pillow reduction
• Heat resistance to high pre-heating -temperature
• Void reduction
• Solderability at small lands

Specifications

Test condition
Stencil thickness:100μm
Opening:0.24mmφ

Features:

• Stable printability
• Compatible with various components
• Void reduction
• Good results at ICT

Features:

• Void reduction
• Less flux  scattering
• Low flux residues
• Printability improved

Features:

• Halogen compounds are not intentionally added
• Stable printability with continuous printing
• Good solder ability in air reflow
• Suitable with conventional lead-free standard reflow profile

Features:

• Low flux residues (good results at ICT)
• Less flux  scattering
• Applicable to vacuum reflow
• Excellent electrical reliability

Features:

• Flux residue can easlily be removed  using hydrocarbon-base or semi-aqueous detergents
• Good solderablity with fine pitch components: 0.4mmP QFP
• Good solderbility/ wettability to various components

After（50℃/5minute）

Features:

• Flux residue removable by water cleaning after high-temperature reflow
• Good solderability compatible with 0.4mm-pitch CSP and other fine patterns
• Good solderability compatible with both nitrogen and air reflow

Printability at 0.4mm pitch

Features:

• For low-temperature air reflow
• Stable printability with continuous printing
• Good solder ability to various components

Features:

• Good solder ability/wettability
• Less solder balls
• Excellent printability